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Requirements and Characterization of Electrical and Electronics Assemblies
7. Certified IPC Specialist in IPC/EIA J-STD-001 "Requirements for Soldered Electrical and Electronic Assemblies"
The J-STD-001 is the authority for electronics assembly manufacturing. It has been adopted by the U.S. Department of Defense to replace Mil-Std-2000. The standard describes materials, methods and verification criteria for producing high quality soldered interconnections. It emphasizes process control and sets industry-consensus requirements for a broad range of electronic products. Learn assembly procedures for Wire and Terminals, Through-Hole and Surface Mount technology. Students will demonstrate soldering skills and deliver a brief presentation along with completing open and closed book exams. Customize this course by selecting only the days/modules that meet your training requirements.
- Soldering Wire/Terminal Connections
- Soldering Through-Hole Components
- Soldering SMT Components, including Fine Pitch
- Selecting and using the proper tools. Understanding industry terminology
- Recognizing acceptable criteria for all solder connections
- Selecting solder, flux and solder paste
- Applying accepted cleaning requirements
DAY 1 - Module 1
Overview of J-STD-001
Students will learn the requirements of J-STD-001 and related standards as they apply to operators and inspectors involved in the assembly of products to the requirements of J-STD-001. Module 1 is a prerequisite to all other modules.
- Course Overview
- Classes of Equipment
- Solder Theory
- Solder Flux and Solder Alloys
- Facilities, Tools & Equipment
- PTH - Assembly/Solder
- Surface Mount Technology
- Module 1 Review
- Module 1 Examination
DAY 2 - Module 2
Wires & Terminals
Students will learn the requirements of J-STD-001, and demonstrate the skills for stripping and tinning wire and hand soldering wires of different gauges to various types of commonly used solder terminals.
- Wire Preparation
- Solder to Terminals
- Terminal Inspection
- Wire & Terminal Demonstration
- Wire & Terminal Lab
- Module 2 Review
- Module 2 Examination
DAY 3 - Module 3
Students will learn the requirements of J-STD-001, and demonstrate the skills for preparing and mounting Through-Hole components to PWBs.
- Lead Preparation
- Component Mounting
- PTH Inspection Criteria
- PTH Soldering Demonstration
- PTH Lab
- Module 3 Review
- Module 3 Examination
DAY 4 - Module 4
Surface Mount Technology
Students will learn the requirements of J-STD-001, and demonstrate the skills for preparing and mounting Leaded and Leadless Surface Mount components to PWBs.
- SMT Criteria
- SMT Inspection Criteria
- SMT Demonstration
- SMT Lab
- Module 4 Review
- Module 4 Examination
DAY 5 - Module 5
Students will learn the quality and inspection requirements of J-STD-001.
- Theory of Inspection, SPC
- Defect Definition and Disposition
- Inspection Skills Demonstration
- Inspection Skills Lab
- Module 5 Review
- Module 5 Examination
- IPC-J/STD-001 Standard
- IPC-J/STD-001 Student Handbook
- IPC Certificate of Training
475 EUR/participant (the fee includes all original documents from IPC).
Maximum number of participants is 10.
One final exam will be used at the end of the course to evaluate the performance. The exam is divided in two parts, one Open Book Examination and one Closed Book examination.
Who should attend
The course emphasis is on J-STD-001 document interpretation. Experienced assemblers who wish to gain in depth background on soldering practices should become certified to this program. As this course is designed to compliment existing soldering skills, prior soldering experience is recommended.
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